2xCOM 2xLAN DP HDMI Input 12V DC Input 24V DC Intel Core i3 Intel Core i5 Intel Core i7 Intel Core i9 LAN PCIex Bus Standard T range

12/13th Gen Intel® Core™ Processor (Raptor Lake/Alder Lake), Mini-ITX with Q670E/H610E, PCIex16 Gen4, 2.5GbE, DCin power input Advantech AIMB-279

Price and avalability

Partnumber Description Price VAT incl Avalability
AIMB-279QF-LDA1 Промислова материнська плата AIMB-279 mITX на процесорах Intel® Core™ 12/13-го покоління (Raptor Lake/Alder Lake), з Q670E, PCIex16 Gen4, 2.5GbE, DCin  24 328,9  
AIMB-279HL-EDA1 Промислова материнська плата AIMB-279 mITX на процесорах Intel® Core™ 12/13-го покоління (Raptor Lake/Alder Lake), з H610E, PCIex16 Gen4, 2.5GbE, DCin  19 784,5  
  • 12th/13th Gen Intel® Core™ Desktop Processors, max. 24Core, support Q670E/H610E chipset
  • Up to 64GB DDR4 3200MHz with two SODIMM
  • PCIe x16 Gen4 (16GT/s)
  • Four independent displays with 2 DP, 1 HDMI, 1eDP
  • Rich expansion: 1 M.2 M key & 1 M.2 E key, 4 USB 3.2 & 2 USB2.0, 2 SATA
  • 12-24V DCIN power input
  • WISE-DeviceOn and Embedded Software APIs

13th Generation Processors

CPU i9-13900E / i9-13900 i9-13900TE i7-13700E / i7-13700 i7-13700TE i5-13500E / i5-13500 i5-13500TE i5-13400E/ i5-13400 i3-13100E / i3-13100 i3-13100TE
Core Number 24 24 16 16 14 14 10 4 4
Base frequency (GHz) 1.8/2.0 1 1.9/2.1 0.8 2.4/2.6 1.3 2.4/2.5 3.3/3.4 2.4
Max Speed (GHz) 5.2/5.6 5 5.1/5.2 4.8 4.6/4.8 4.5 4.6 4.4/4.5 4.1
Smart cache (MB) 36 36 30 30 24 24 20 12 12
TDP (W) 65 35 65 35 65 35 65 60 35
12th Generation Processors
CPU i9-12900E / i9-12900 i9-12900TE i7-12700E / i7-12700 i7-12700TE i5-12500E / i5- 12500/12400 i5-12500TE i3-12100E / i3-12100 i3-12100TE G7400E G7400TE G6900E G6900TE
Core Number 16 16 12 12 6 6 4 4 2 2 2 2
Base frequency (GHz) 2.3/2.4 1.1 2.1 1.4 2.9/3.0/2.5 1.9 3.2 2.1 3.6 3 3 2.4
Max Speed (GHz) 5 4.8 4.8 4.7 4.5/4.6/4.4 4.3 4.2/4.3 4 NA NA NA NA
Smart cache (MB) 30 30 25 25 18 18 12 12 6 6 4 4
TDP (W) 65 35 65 35 65 35 60 35 46 35 46 35

Additional information

Processor System

Chipset Q670E / H610E
BIOS AMI EFI 256Mb SPI

Expansion Slot

M.2 1 M-Key for SSD, 1 E-Key for Wireless connection
PCIe x16 PCIe x16 Gen4 (16GT/s) for discrete GPU card and storage devices

Memory

Technology Dual Channel DDR4, up to 3200 MHz (non-ECC)
Max. Capacity 64GB (up to 32GB per SODIMM)
Socket 2 x 260pin SODIMM

Graphics

Controller Intel® UHD Graphics Driven by Xe Architecture
HDMI HDMI2.0b, supports max. resolution 4096 x 2160 @ 60 Hz
DP 2 DP++, DP1.4a, supports max. resolution 4096 x 2304 @ 60 Hz
eDP By option, with internal pin header, supports max. resolution 4096 x 2304 @ 60 Hz
LVDS By default, internal pin header, supports singel/dual channel 18/24-bit with maximum resolution up to 1920 x 1200 @ 60 Hz (eDP colay with LVDs)
Multi Displays up to 4 independent displays (4 with Q670E)

Network

ETHERNET up to 2500 Mb/s
Controller
  • LAN1: Intel i219 (GbE)
  • LAN2: Intel i226 (2.5GbE)
Connector 2 x RJ45

SATA

Max data transfer rate 600 MB/s
Channel 2 x SATAIII

Rear I/O

DP 2
HDMI 1
Ethernet 2
USB 2 ports USB3.2 Gen2x1
Audio 1 (Line in/Line out/Mic in)

Internal Connector

USB 2 ports USB3.2 Gen1x1 & 2 ports USB2.0
LVDS/eDP 1 (LVDs colay with eDP)
Serial 2 ports (COM1 RS232, COM2 RS232/422/485)
SATA 2
M.2
  • 1 M-key (dimension: 2242)
  • 1 E-key (dimension: 2230)
GPIO 8-bit

Watchdog Timer

Output System reset
Interva Programmable 1 ~ 255 sec/min

Power Requirements

i9-13900E 5.2GHz, 2pcs 32GB DDR4 3200MHz, 24V @4.45A with 24V DC Input adapter

Environment

Temperature Operating: 0 ~ 60° C (32 ~ 140° F), depends on CPU speed and cooler solution
Storage Non-Operating: -40 ~ 85° C (-40 ~ 185° F)

Physical Characteristics

Dimensions 170 mm x 170 mm (6.69" x 6.69")

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